NEPCON China 2021, April 21-23, Shanghai World Expo Exhibition and Convention Center
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GMF news - World Trade Fair Guide. Turin, August 24, 2020 – NEPCON China 2021 will be held in Shanghai World Expo Exhibition and Convention Center from April 21-23. As an international event for the electronic manufacturing industry, it will focus on the display of equipment & technology of surface mount technology (SMT), soldering and dispensing, smart factory and automation, test and measurement, and new electronic materials.
The Expo will attract more than 500 exhibitors and brands, displaying innovative solutions to more than 30,000 professional buyers from EMS/OEM/ODM factories of consumer electronics and hot industries and fields such as 5G, communication, smart home, IoT, automotive electronics and semiconductor packaging.
NEPCON China 2021 will specially launch innovative pavilion and conferences such as the Electronic Micro-Assembly & SiP Process Pavilion, the Electronic Micro-Assembly & SiP Process Conference, 2021 AWC Conference on Development and Testing Technologies for NEV Electromobility System and the Smart Manufacturing Dream Factory Conference, concurrently with the Smart Factory and Automation Technology Expo, to lead the future trend of smart manufacturing in the electronic industry.
By participating in the NEPCON China, industrial well-known forums and high-end conferences, business recommendation and match-making services, and new product guide tour, the visitors can obtain new industry technologies, gain insight into product trends and achieve one-stop purchasing.
• 500 exhibitors Brands
• 35,000 sqm exhibition area
• 30,000 local and international visitors
• Numerous high quality technological symposiums
Featured Pavilions:
• "Surface Mount Technology Pavilion"covers the complete production chain including mounting, welding, dispensing and spraying, testing and measurement, and intensively displays the well-known brands in the world.
• "Smart Factory & Automation Technology Expo 2019"displays the applications of advanced “industrial automation” technology and “system integration” plan in electronics manufacturing industry.
• "Electronic Materials Pavilion"provides a business platform for electronic material enterprises to communicate with the R&D and design personnel of terminal users, project manager / leader, technical personnel, purchase / marketing / sales personnel in the form of “meeting + pavilion”.
• "Electronic Micro-assembly and SiP Process Pavilion " serves as a comprehensive professional exhibition platform of electronic micro-assembly, circuit board assembly and finished product assembly that leads the development trend of advanced packaging industry.
• "Test and Measurement Pavilion" a professional exhibition and conference platform that is dedicated to displaying electronic product testing technology, leading the development trend of testing and measuring industry, and disseminating the advanced factory management concepts and latest industry technical information.
• "Soldering and Dispensing Pavilion" display new equipment and new technology at site and provide buyers with more intelligent welding, dispensing and spraying technology options.
https://www.nepconchina.com/en-gb.html
Exhibitors,please contact
Julia Gu
Reed Exhibitons
Tel:+86 21 2231 7010
Fax:+86 21 2231 7181
Email:Julia.gu@reedexpo.com.cn
Media, please contact
Jamie Xu
Reed Exhibitons
Tel: +86 21 2231 7042
Fax:+86 21 2231 7181
Email:jamie.xu@reedexpo.com.cn
For service and inquiries, please contact
Charlene Wu
Reed Exhibitons
Tel:+86 21 2231 7033
Fax:+86 21 2231 7181
Email:jiaying.wu@reedexpo.com.cn
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